Technology market

Key Development and Adoption Challenges TIMs Face in Commercialization

DUBLIN, August 30, 2022 /PRNewswire/ — The “Global Material Technologies for Thermal Management in 5G Device Growth Opportunities” report has been added to from offer.


This study focuses on emerging developments and advances in materials technology to improve and mitigate thermal management issues in 5G devices, highlights the need for thermal management solutions such as thermal interface materials (TIM ) in 5G devices, and discusses key development and adoption challenges. that TIMs face in their commercialization.

All 5G devices include radio units, active antennas and other components with greater density in smaller spaces. This arrangement of high power components requires greater power consumption, generating more heat. The increased heat can cause components to burn out, which has a significant impact on the entire network.

Additionally, overheating of these devices can cause the device to drop in performance or crash, resulting in network issues, crashes, and downtime. As this problem can significantly affect the personal and professional life of users, it is important to ensure efficient heat dissipation in 5G devices.

Hardware technologies with superior capabilities for thermal management of 5G devices come with significant trade-offs. For example, acrylics that form stronger bonds soften at high temperatures. This scenario creates the demand for new material technologies in thermal management that can offer attractive properties and undergo high-volume manufacturing.

TIMs can improve heat transfer and dissipate heat from electronic devices. TIMs usually stay between heat-generating components and heat sinks or dissipating devices.

The different forms of TIM covered by this research include:

  • Thermally Conductive Adhesives

  • Phase change materials (PCM)

  • Thermal space fillers

  • Thermal bands

  • Thermal paste

  • Others (thermal interface coatings, thermally conductive material (TCH) and graphite pads)

Main topics covered:

  • Current scenario in 5G infrastructure – commercial availability, trends in all regions

  • Important Factors Driving TIM Adoption

  • Technological analysis and need for thermal management

  • Stakeholder Activities in Materials for Thermal Management of 5G Devices

  • Material patent analysis for thermal management of 5G devices

  • Growth Opportunities for Materials in Thermal Management of 5G Devices

Key focus areas include:

  • The Need for Effective Thermal Management in 5G Devices

  • Overview of factors driving demand for TIM

  • Technological analysis of the best materials in the manufacture of TIMs

  • Comparative evaluation of different types of materials in TIMs according to various parameters, such as thermal conductivity, electrical resistivity and coefficient of thermal expansion

  • Different Types of TIMs, Their TRLs, Advantages, Disadvantages and Key Stakeholders

  • Analysis of patents of different types of TIM

  • Growth Opportunities for Materials Developers in Thermal Management Systems

Main topics covered:

1. Strategic imperatives

  • Why is it increasingly difficult to grow taller? The Strategic Imperative: Factors Putting Pressure on Growth

  • The strategic imperative

  • The Impact of Top 3 Strategic Imperatives on Material Technologies for Thermal Management in 5G Devices

  • Growth opportunities fuel the growth pipeline engine

  • Research Methodology

2. Research scope and segmentation

3. Analysis of growth opportunities

  • Factors driving the paradigm shift in mobile communications – 4G to 5G

  • Availability of 5G worldwide

  • Current status of 5G devices around the world

  • Efforts to increase the development of 5G applications

  • China’s top vendors dominate the 5G device ecosystem

  • Mapping of operator investments in 5G networks

  • Stakeholders driving 5G adoption across industries

  • Product development, launch and acquisition are key to facilitating the development of 5G devices

  • Global financing and investment activity in thermal management solutions is on the rise

  • Need for effective thermal management for 5G devices

  • capable TIMs to solve the engineering challenges of 5G devices

4. Technologies for efficient thermal management

  • Importance of TIMs

  • Polymers as the most common matrix/base material in TIMs

  • The high thermal conductivity of nanomaterials is gaining ground in TIMs

  • High mechanical strength, operating temperature and low thermal expansion drive demand for ceramic-based TIM

  • Low cost, easy availability and high thermal conductivity of metals positively influencing its adoption rate in TIMs

  • Composites to provide greater thermal efficiency than conventional silicon-based materials

  • Silicone is the most widely used polymer due to its high thermal conductivity

  • The high thermal conductivity of nanomaterials and metals is a key parameter for adoption in TIMs

  • The electrical resistivity of ceramic is a key parameter for its adoption in TIMs

  • Comparative evaluation of various material classes in TIMs

  • Thermally conductive adhesives Ideal alternative to soldering applications

  • High fluidity meeting the demand for thermal greases

  • PCMs offer better functionality than thermal grease

  • Thermal filler pads cleaner to use than thermal pastes and easier to remove than thermal adhesives.

  • Easy handling and low cost driving demand for thermal tapes

  • Others: thermal interface coatings, hardware and pads

  • Comparative evaluation of various forms of TIM

  • Mapping of different material classes to recommended shape and devices

  • Application Prospects of Different Forms of TIM in Various Industries

5. IP analysis for thermal management of 5G devices

  • US leads in patent filing for thermal management technologies (2017-2021)

  • Stagnant growth of PCMs and declining trend of thermal tapes between 2017 and 2021

  • End-use industries drive increased research activity in space fillers and thermal greases

  • Increasing focus on sustainability is vital in patenting thermally conductive adhesives

  • Thermal grease as the most searched form and polymer as the most searched material during the period 2017-2021

6. Universe of growth opportunities

  • Growth Opportunity 1: Adopting ceramic materials technologies for better thermal management

  • Growth Opportunity 2: Strategic collaborations between different value chain stakeholders for technology advancement

  • Growth Opportunity 3: Using Materials Informatics to Accelerate Research into New Materials for Thermal Management

7. Appendix

For more information on this report, visit

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