Growing demand for miniaturization of electronic devices to provide growth opportunities for embedded chip packaging technology market
NEW YORK, USA, February 3, 2022 /EINPresswire.com/ — According to our latest market research on “Embedded Die Packaging Technology Market Forecast to 2028 – Impact of COVID-19 and Global Analysis – by Platform, Application, Vertical, and Geography”, the market was valued at US$63.40 million in 2020 and is projected to reach US$242.80 million. US dollars by 2028; it is expected to grow at a CAGR of 18.6% during the forecast period from 2021 to 2028.
Report Cover Details
Market size value in US$63.40 million in 2020
Market size value of US$242.80 million by 2028
CAGR growth rate of 18.6% from 2021 to 2028
Forecast period 2021-2028
Base year 2021
Number of pages 158
Tables No. 65
Number of graphs and figures 74
Historical data available Yes
Segments Covered Platform, Application & Industry, Geography
Regional scope North America; Europe; Asia Pacific; Latin America; AEM
Countries Covered USA, UK, Canada, Germany, France, Italy, Australia, Russia, China, Japan, South Korea, Saudi Arabia, Brazil, Argentina
Report Coverage Revenue Forecast, Business Ranking, Competitive Landscape, Growth Factors and Trends
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The growing trend of small form factor portable electronic devices is one of the major factors that is accelerating the growth of the market. Technological advancements in electronics manufacturing, such as miniaturization, have influenced various markets including military, aerospace, medical, media, retail, and consumer electronics. Devices with small form factor based packages pack in more features. They become an alternative to traditional packaging systems. Personalized healthcare gadgets, small smartphones, form factor PCs and other devices are designed with integrated components based on chip packaging technology, such as processors, sensors, RF modules, etc
The embedded die packaging technology market is segmented into platform, application, vertical, and geography. Based on platform, the embedded chip packaging technology market is further classified into IC package substrate, rigid board, and flexible board. Based on application, the integrated die packaging technology market is further segmented into smartphones & tablets, medical & wearable devices, industrial devices, and security devices. Based on industry, the embedded chip packaging technology market is further segmented into automotive, healthcare, consumer electronics, IT & telecommunications, and others.
Impact of the COVID-19 Pandemic on the Integrated Die Packaging Technology Market
The COVID-19 pandemic has hampered the semiconductor industry and the economic growth of almost every country. The semiconductor industry has been hit hard by reduced demand for electronic components from all industrial sectors and end consumers. The microelectronics revenue model declined as there was no mass production during the lockdown period. After the lockdown, the semiconductor industry started to regain market share as production facilities restarted operations, with preventive measures. Additionally, work from home and remote monitoring strategies have also helped increase the sale of advanced electronics for better connectivity.
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Growing demand for miniaturization of electronic devices
Electronic gadgets are developed using small form factor electronic components to enhance the space and enhance the design of the final product. Customers prefer small and compact portable electronic devices with maximum functionality. To improve the user experience, companies are developing miniaturized electronics to integrate as many components as possible on a single chip. Integrating the maximum number of components, such as sensors and processors, into a single die provides enhanced functionality for customers. The increase in the tech-savvy population is one of the main drivers for the miniaturization of electronics, as it has created fierce competition among market players to offer the maximum functionality in a single device.
Application-Based Market Overview of Integrated Die Packaging Technology
In terms of application, the global integrated die packaging technology market is segmented into smartphones & tablets, medical & wearable devices, industrial devices, security devices, and others. Emerging need for microelectronics from various verticals including automotive, healthcare, and consumer electronics for small-factor based applications is supporting the growth of the market. The growing trend of reducing the size and improving the functionality of electronic devices is driving the adoption of embedded chip packaging technology for cell phones and tablets.
Embedded Die Packaging Technology Market: Competitive Landscape and Key Developments
ASE Group; Microsemi; General electricity company; Taiwan Semiconductor Manufacturing Company, Limited; Fujikura Ltd. ; Shinko Electric Industries Co., Ltd. ; Schweizer Electronic AG; Amkor Technology, Inc.; Infineon Technologies Ag; and AT&S Austria Technologie & Systemtechnik Aktiengesellschaft are among the leading players in the global integrated die packaging technology market. Leading companies are focusing on expanding and diversifying their market presence and acquiring new customer base, thereby exploiting existing business opportunities.
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In August 2020, Schweizer Electronic AG entered into a sales representation agreement with Varikorea Co., Ltd to promote SCHWEIZER’s high-tech printed circuit boards and integration solutions in South Korea.
In August 2020, Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) has launched a new advanced 3D silicon bonding and packaging technology.
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